My Cart:

0 item(s) - $0.00
You have no items in your shopping cart.


Rossmann Repair Group Inc

More Views

MJ 3D iPhone Stencil for BGA Reballing, Template For IPhone A8 A9 A10

Availability: In stock


Quick Overview

High quality 3D BGA stencil for iPhone chip reballing.

* Required Fields

  • Details

    Chips align themselves!

    These stencils include grooves that the chips fit into, removing the frustration of having to position the chip in just the right spot. 

    Highly durable!

    Thicker and more durable than standard stencils, less tendency of deformation for longer life. 

    Square holes for easy removal. 

    Additional Information

    Compatible boards No

    Product Questions

    No questions yet. Be the first to ask the question!